Published

2005-05-01

Rheological models applied to wheat and corn dough

Modelos reológicos aplicados a masas de trigo y maíz

DOI:

https://doi.org/10.15446/ing.investig.v25n2.14646

Keywords:

dough, rheology, rheological model, wheat, corn (en)
masa, trigo, maíz, modelos reologicos, reología (es)

Authors

  • Eduardo Rodríguez Sandoval Universidad del Valle
  • Alejandro Fernández Quintero Universidad del Valle
  • Alfredo Ayala Aponte Universidad del Valle

Rheological models of a food system are useful for simulating a material’s response to an applied stress or strain and for predicting the effect of composition and processing conditions. Rheological models can be applied when experimental data is expressed in fundamental units. This article describes two rheological models used for studying wheat and corn dough: the biaxial extensional model and the oscillatory dynamic model. The results of research related to this topic are also reported.

Los modelos reológicos de un alimento procesado permiten simular la respuesta del material a un esfuerzo o deformación aplicada, al igual que predecir el comportamiento del material de acuerdo a su composición y su forma de preparación. Su aplicación se puede llevar a cabo cuando se tienen datos experimentales expresados en unidades fundamentales. Este artículo describe dos modelos reológicos empleados en el estudio de masas de trigo y maíz, el modelo extensional biaxial y el modelo dinámico oscilatorio. Además, muestra los resultados de algunas investigaciones sobre este tema.

References

Bagley, E. B., “Constitutive models for doughs”, en Food Extrusion Science and Technology, ed. Kokini, J. L., Ho, C. y Karwe, M. New Cork, Marcel Dekker Inc., 1992, pp. 203-211.

Berland, S. y Launay, B., Rheological properties of wheat flour dough in steady and dynamic shear: Effect of water content and some additives, En: Cereal Chemistry, Vol. 72, No. 1, 1995, pp. 48 -52.

Gunasekaran, S. y Ak, M. M., “Dynamic oscillatory shear testing of foods-selected applications”, en Trends in Food Science & Technology, Vol. 11, 2000, pp. 115-127. DOI: https://doi.org/10.1016/S0924-2244(00)00058-3

Létang, C.; Piau, M. y Verdier, C., “Characterization of wheat flour-water dough. Part I. Rheometry and microstructure”, en Journal of Food Engineering, Vol. 41, 1999, pp. 121-132. DOI: https://doi.org/10.1016/S0260-8774(99)00082-5

Limanond, B., Castell-Pérez; E. y Moreira, R. G., “Effect of time and storage conditions on the rheological properties of masa for corn tortillas” en Lebensmittel Wissenshaft und Technologie, Vol. 32, 1999, pp. 344-348. DOI: https://doi.org/10.1006/fstl.1999.0563

Rao, M. A., Rheology of fluid and semisolid foods: principles and applications, Maryland, Aspen publications, 1999, pp.100-105.

Rao, V. G. y Rao, H. P, “Methods for determining rheological characteristics of doughs: A critical evaluation”, en: Journal of Food Science, Vol. 30, No. 2, 1993, pp. 77-87.

Shim, J. y Mulvaney S. J., “Effects of pregelatinization conditions and added whey protein isolate on corn starch dough properties”, en Cereal Foods World, Vol. 47, No. 9, 2002, pp. 440-446.

Steffe, J., Rheological methods in food process engineering, Michigan, Freeman, 1996, pp.1-10, 258-262, 295-317.

Wang, F. C. y Sun, X. S., “Creep-recovery of wheat flour doughs and relationship to other physical dough tests and breadmaking performance”, en Cereal Chemistry, Vol. 79, No. 4, 2002, pp. 567-571. DOI: https://doi.org/10.1094/CCHEM.2002.79.4.567

Wikström, K., “Rheology of wheat flour dough at large deformations and the relation to baking quality and physical structure”, tesis doctoral presentada a la Universidad de Lund, Lund, Suecia, 1997.

How to Cite

APA

Rodríguez Sandoval, E., Fernández Quintero, A. and Ayala Aponte, A. (2005). Rheological models applied to wheat and corn dough. Ingeniería e Investigación, 25(2), 87–93. https://doi.org/10.15446/ing.investig.v25n2.14646

ACM

[1]
Rodríguez Sandoval, E., Fernández Quintero, A. and Ayala Aponte, A. 2005. Rheological models applied to wheat and corn dough. Ingeniería e Investigación. 25, 2 (May 2005), 87–93. DOI:https://doi.org/10.15446/ing.investig.v25n2.14646.

ACS

(1)
Rodríguez Sandoval, E.; Fernández Quintero, A.; Ayala Aponte, A. Rheological models applied to wheat and corn dough. Ing. Inv. 2005, 25, 87-93.

ABNT

RODRÍGUEZ SANDOVAL, E.; FERNÁNDEZ QUINTERO, A.; AYALA APONTE, A. Rheological models applied to wheat and corn dough. Ingeniería e Investigación, [S. l.], v. 25, n. 2, p. 87–93, 2005. DOI: 10.15446/ing.investig.v25n2.14646. Disponível em: https://revistas.unal.edu.co/index.php/ingeinv/article/view/14646. Acesso em: 29 mar. 2024.

Chicago

Rodríguez Sandoval, Eduardo, Alejandro Fernández Quintero, and Alfredo Ayala Aponte. 2005. “Rheological models applied to wheat and corn dough”. Ingeniería E Investigación 25 (2):87-93. https://doi.org/10.15446/ing.investig.v25n2.14646.

Harvard

Rodríguez Sandoval, E., Fernández Quintero, A. and Ayala Aponte, A. (2005) “Rheological models applied to wheat and corn dough”, Ingeniería e Investigación, 25(2), pp. 87–93. doi: 10.15446/ing.investig.v25n2.14646.

IEEE

[1]
E. Rodríguez Sandoval, A. Fernández Quintero, and A. Ayala Aponte, “Rheological models applied to wheat and corn dough”, Ing. Inv., vol. 25, no. 2, pp. 87–93, May 2005.

MLA

Rodríguez Sandoval, E., A. Fernández Quintero, and A. Ayala Aponte. “Rheological models applied to wheat and corn dough”. Ingeniería e Investigación, vol. 25, no. 2, May 2005, pp. 87-93, doi:10.15446/ing.investig.v25n2.14646.

Turabian

Rodríguez Sandoval, Eduardo, Alejandro Fernández Quintero, and Alfredo Ayala Aponte. “Rheological models applied to wheat and corn dough”. Ingeniería e Investigación 25, no. 2 (May 1, 2005): 87–93. Accessed March 29, 2024. https://revistas.unal.edu.co/index.php/ingeinv/article/view/14646.

Vancouver

1.
Rodríguez Sandoval E, Fernández Quintero A, Ayala Aponte A. Rheological models applied to wheat and corn dough. Ing. Inv. [Internet]. 2005 May 1 [cited 2024 Mar. 29];25(2):87-93. Available from: https://revistas.unal.edu.co/index.php/ingeinv/article/view/14646

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