Publicado

2014-07-01

Alternative methods to attach components in printed circuit boards to improve their recyclability

Métodos alternativos de fijación de componentes de circuitos impresos para mejorar su reciclabilidad

DOI:

https://doi.org/10.15446/dyna.v81n186.39760

Palabras clave:

Printed circuit boards, Welding replacement, Environmental problem, Recyclability (en)
Placas de circuitos impresos, Reemplazo de soldadura, Problema ambiental, Reciclabilidad (es)

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Autores/as

  • André Canal-Marques Universidade Federal do Rio Grande do Sul
  • Maria Rita Ortega-Vega Universidade Federal do Rio Grande do Sul
  • José María Cabrera Universitat Politécnica de Catalunya
  • Célia de Fraga-Malfatti Universidade Federal do Rio Grande do Sul

Printed circuit boards (PCB), which form the basis of the electronics industry, generate wastes that are difficult to dispose of and recycle due to the diversity of their materials and components and their difficult separation. The replacement of Pb-Sn welding for lead-free alloys to attach components in printed circuit boards is an attempt to minimize the problem of Pb toxicity, but it does not change the problem of separation of the components for later reuse and/or recycling. This article presents a review of the environmental problem of printed circuit boards, the initial development of alternative fixation studies, and reliability tests for comparison with conventional boards and commercial systems to validate or serve as a basis for future research, focused on PCB disassembly for recycling. At present, initial studies were performed by using prototypes for visual and functional tests.

Las Placas de Circuitos Impresos constituyen la base de la industria electrónica. Sin embargo, generan residuos de difícil eliminación y reciclaje, debido a la diversidad de materiales y componentes presentes y su difícil separación. La sustitución de soldaduras de Pb-Sn por aleaciones libres de plomo intenta minimizar la toxicidad que implica la presencia de Pb, pero no aborda la separación de los componentes para su posterior reutilización y/o reciclaje. Este artículo presenta una revisión bibliográfica sobre el problema ambiental que constituyen las placas de circuitos impresos, el estudio de alternativas de fijación, pruebas de fiabilidad para comparar con las placas convencionales y sistemas comerciales para validar o servir de base para futuras investigaciones, enfocadas hacia el desmontaje de PCI. Además, se muestran algunos estudios incipientes mediante prototipos para la realización de pruebas visuales y funcionales.

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Citas

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