Effect of additives on diffusion coefficient for cupric ions and kinematics viscosity in CuSO4-H2SO4 solution at 60°C
Efecto de aditivos en el coeficiente de difusión de iones cúpricos y la viscosidad cinemática en solución CuSO4-H2SO4 a 60°
DOI:
https://doi.org/10.15446/dyna.v81n188.41815Palabras clave:
diffusion coefficient cupric ions, electrorefining copper, glue, thiourea, chloride (en)coeficiente de difusión iones cúpricos, electrorefinación cobre, cola, tiourea, cloruro (es)
Referencias
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